F141 半導体プロセスの将来と熱工学の応用
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概要
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Regarding to the future thermal processes for 65nm node and beyond, innovation for both higher temperature processes up to Si melting point and temperature lowering less than 450 degrees are required. Thermo-Engineering must be a key for these innovations based on temperature measurement and temperature control in thermal processes. Transdisciplinary approach which overcome interdisciplinary methods may be also expected to solve the issues for future difficulties and to create new innovations.
- 一般社団法人日本機械学会の論文
- 2002-11-06