F132 ベアチップ冷却用ヒートスプレッダーに関する研究 : チップ最高温度に及ぼす周囲境界条件の影響

概要

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A simple plate type heat spreader with high thermal conductivity is one of the promising heat transfer elements for bare chip cooling. The chips equipped with such a heat spreader plate have been commercially provided since the late 1990s. However, the role of the spreader plate in the bare chip cooling system has not been made clear at all. Accordingly, in an attempt to clarify the heat transfer mechanism in the cooling system and to propose a rational thermal design concept, we have been conducting numerical analysis using a two-dimensional cylindrical model. In the present study, the effect of surrounding boundary conditions on the maximum chip temperature is clarified from a series of numerical calculations.
社団法人日本機械学会の論文
2002-11-06