F211 熱輸送デバイスの現状と限界(オーガナイズドセッション22 : 熱輸送デバイス)

概要

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The total power and the power density of both the electronic and the optical equipments are increasing more and more, which requires the better performing heat transfer devices. In this paper, we reviewed the recent technologies of the thermal management for the Micro-Processor-Units (MPUs) and the optical fiber amplifiers, and estimated that the heat transfer devices with present performance would not meet the requirements. Instead of the improvement of conventional heat pipes and the development of the new type of heat pipes, there is yet much to be settled. Among the works progressing now, the study of the heat transfer in micro-channels would be the promising approach to the new devices.
一般社団法人日本機械学会の論文
2001-11-03