E209 風洞内、及びベンチマーク筐体内におけるP-BGAの無抵抗評価(オーガナイズドセッション21 : 電子機器の熱設計と解析の応用)
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概要
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The thermal resistance θ_<ja> of a plastic ball grid allay (P-BGA) mounted on a low thermal conductive PCB was measured in two different environments; a wind tunnel and an enclosure. The gap between the PCB and the bottom wall in the enclosure is 1 mm, and those in the wind tunnel are 1mm and 30mm. The measured θ_<ja> of the P-BGA in the enclosure indicated that it depended on the number of fans but did not depend on the location of the fans. The thermal resistance of P-BGA was 18.6℃/W with one fan active, 16.0℃/W with two fans active, and 14.7℃/W with three fans active. The measured upstream air velocity in the enclosure was 0.25〜0.3 m/s per fan. It was found by comparing θ_<ja> in the enclosure with that in the wind tunnel that the cooling effect in the enclosure was not equivalent to that for the gap of 1 mm in the wind tunnel, but to that for 30 mm.
- 一般社団法人日本機械学会の論文
- 2001-11-03
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関連論文
- 1835 ベンチマーク筐体内でファン空冷される P-BGA の熱流体解析
- E209 風洞内、及びベンチマーク筐体内におけるP-BGAの無抵抗評価(オーガナイズドセッション21 : 電子機器の熱設計と解析の応用)