ORS-06 3D MEASUREMENT OF MICRO THERMAL DEFORMATION IN AN OPTICAL PICK-UP BASE USING HOLOGRAPHIC INTERFEROMETRY

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概要

• 論文の詳細を見る

• An experimental method is presented to measure micro-thermal deformation of an optical pick-up base using the holographic interferometry. The thermal deformation of an aluminum pick-up base, manufactured from die-casting process, was measured in actual thermal environments using the present holographic interferometry. The experimental result using the holographic interferometry was compared with Finite element analysis with initial surface stress conditions obtained from X-ray diffraction measurements.

• 一般社団法人日本機械学会の論文

著者

• Cho Sunghoon

  Center For Information Storage Device Yonsei University

• Kang Shinill

  Center For Information Storage Device Yonsei University

• Seo Youngmin

  Center for Information Storage Device, Yonsei University

• Seo Youngmin

  Center For Information Storage Device Yonsei University

関連論文

• ORS-06 3D MEASUREMENT OF MICRO THERMAL DEFORMATION IN AN OPTICAL PICK-UP BASE USING HOLOGRAPHIC INTERFEROMETRY
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