221 Development of Chemo-Mechanical Grinding (CMG) Process
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概要
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To achieve a perfectly damage-free surface by fixed abrasive, this research has proposed a new chemo-mechanical-grinding (CMG) process by effective using chemical reaction at the grinding process. First described in this paper are the experimental results showing the feasibilities of the CMG process in reducing subsurface damage, followed by development and characterization of CMG wheel with a wide range of pH from acidity to alkalinity. The CMG process has been applied mainly into φ300mm bare Si wafers, and its performance has been evaluated by comparing to grinding with diamond wheels.
- 一般社団法人日本機械学会の論文
著者
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Eda H.
Ibaraki University
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Kimura S.
Tokyo Inst. of Tech.
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Zhou L.
Ibaraki University
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Kawaii S.
Graduated School of Ibaraki University
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Shimizu J.
Ibaraki University
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- 221 Development of Chemo-Mechanical Grinding (CMG) Process
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