215 Study on Constant Pressure Grinding with EPD Pellets

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概要

• 論文の詳細を見る

• With recent advances in miniaturization technologies of electronic parts, the thinning technique of IC chips has also become important. In this study, a fine abrasive grinding wheel, called EPD pellet, was fabricated and a silicon wafer was ground with constant pressure machining. Constant pressure grinding with silica EPD pellets made a mirror surface about 3.4 nm Ra on the silicon wafers. The highest grinding efficiency was about 2.0,twice as much as case of ordinary constant infeed grinding.

• 一般社団法人日本機械学会の論文

著者

• Shibutani H.

  Production Systems Engineering Toyohashi University Of Technology

• YAMAMOTO Y.

  Production Systems Engineering, Toyohashi University of Technology

• MAEDA H.

  Production Systems Engineering, Toyohashi University of Technology

• SUZUKI H.

  Mechanical Engineering, Kobe University

• HORIUCHI O.

  Production Systems Engineering, Toyohashi University of Technology

関連論文

• 502 Micro-Welding of Glass Plates by YAG Laser : Proposal and Feasibility Study
• 215 Study on Constant Pressure Grinding with EPD Pellets

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