215 Study on Constant Pressure Grinding with EPD Pellets
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概要
- 論文の詳細を見る
With recent advances in miniaturization technologies of electronic parts, the thinning technique of IC chips has also become important. In this study, a fine abrasive grinding wheel, called EPD pellet, was fabricated and a silicon wafer was ground with constant pressure machining. Constant pressure grinding with silica EPD pellets made a mirror surface about 3.4 nm Ra on the silicon wafers. The highest grinding efficiency was about 2.0,twice as much as case of ordinary constant infeed grinding.
- 一般社団法人日本機械学会の論文
著者
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Shibutani H.
Production Systems Engineering Toyohashi University Of Technology
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YAMAMOTO Y.
Production Systems Engineering, Toyohashi University of Technology
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MAEDA H.
Production Systems Engineering, Toyohashi University of Technology
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SUZUKI H.
Mechanical Engineering, Kobe University
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HORIUCHI O.
Production Systems Engineering, Toyohashi University of Technology
関連論文
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- 215 Study on Constant Pressure Grinding with EPD Pellets