105 Improvement of pad life in mirror polishing for GaAs wafers

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概要

• 論文の詳細を見る

• GaAs wafers have contributed greatly to improve the performance of light-receiving and light-emitting devices. For such applications, a very low level of roughness, of the order of 0.1 nmRa, is required on GaAs wafers. If a polishing pad is used for a long time, the polishing rate decreases and the roughness on the wafer increases with increase of polishing time. In this study, the surface morphology of the polishing pad was focused as a dominant factor affecting the polishing rate, and, using an image processing technique, a quantitative approach was tried based on an optical microscope image. For the purpose of increasing the lifetime of polishing pads, a further study was made in which the polishing resistance, which correlates strongly with the polishing rate, was monitored.

• 一般社団法人日本機械学会の論文

著者

• Nishiguchi Takashi

  Hitachi Ltd. Production Research Laboratory Dept. Of Process Technology Solutions

• OOKAWA Tetsuo

  Hitachi, Ltd. Production Research Laboratory Dept. of Process Technology Solutions

• Ookawa Tetsuo

  Hitachi Ltd. Production Research Laboratory Dept. Of Process Technology Solutions

関連論文

• 105 Improvement of pad life in mirror polishing for GaAs wafers

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