Evaluation of Fracture Toughness of PZT Ferroelectric Thin Films by Indentation Fracture Method(Thin Films)

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概要

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• Ferroelectric thin films Pb(Zr_xTi_<1-x>)O_3(PZT) with x=0.58 were deposited on Pt/Ti/Si(001) by pulsed laser deposition (PLD) and the fracture toughness of the film was tested by indentation fracture method. The fracture pattern diagram as a function of indentation load and thin film thickness is introduced. Radial and lateral cracks are observed in indentation with a Vickers diamond indenter. The fracture toughness of PZT thin was determined as 0.47MPa.m^<1/2> and it is much lower than the correspond bulk material. The interfacial fracture toughness for PZT thin film/Si substrate was determined as 3×10^<-4>〜2.3×10^<-3> MPa.m^<1/2>. The interfacial fracture toughness is much lower than the fracture toughness of PZT thin film. In the case of brittle thin film deposited on a brittle substrate, the interface is very weak.

• 2001-10-20

著者

• ZHENG Xuejun

  Institute of Fundamental Mechanics and Material Engineering, Xiangtan University

• ZHOU Yichun

  Institute of Fundamental Mechanics and Material Engineering, Xiangtan University

• YANG Zhiyin

  Institute of Fundamental Mechanics and Material Engineering, Xiangtan University

• YAN Zhi

  Institute of Fundamental Mechanics and Material Engineering, Xiangtan University

• Yan Zhi

  Institute Of Fundamental Mechanics And Material Engineering Xiangtan University

• Zhou Yichun

  Institute Of Fundamental Mechanics And Material Engineering Xiangtan University:fracture Research In

• Yang Zhiyin

  Institute Of Fundamental Mechanics And Material Engineering Xiangtan University

• Zheng Xuejun

  Institute Of Fundamental Mechanics And Material Engineering Xiangtan University:department Of Math.

関連論文

• Evaluation of Fracture Toughness of PZT Ferroelectric Thin Films by Indentation Fracture Method(Thin Films)

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