Evaluation of Crack Closure in a Smart Structure Member with an Embedded Shape-Memory Alloy Wire by Finite-Element Analysis(Composite 4)

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概要

• 論文の詳細を見る

• Crack closure in an epoxy resin plate with an embedded linear shape-memory alloy (SMA) wire as an actuator in smart structure members was investigated as a function of the duration of the supply of electric current to the SMA wire under a tensile load using finite-element analysis (FEA). The recovery force of SMA was considered in the FEA. The simulated isochromatics obtained by the FEA were in good with those obtained by the experiments. Therefore, the simulated isochromatics suggested the possibility of applications in the prediction of crack closure in epoxy resin plates with embedded SMA wires heated by supplying electric current.

• 一般社団法人日本機械学会の論文
• 2001-10-20

著者

• UMEZAKI Eisaku

  Dept. of Mechanical Engineering, Nippon Institute of Technology

• Umezaki Eisaku

  Dept. Of Mechanical Engineering Nippon Institute Of Technology

• Umezaki Eisaku

  Dept. Of Mechanical Engineering Nippon Inst. Of Tech.

• ICHIKAWA Tadashi

  Graduate student, Nippon Institute of Technology

• Ichikawa Tadashi

  Graduate Student Nippon Institute Of Technology

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