Opportunities for the Application of Fracture Mechanics in Microelectronic Packaging

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概要

• 論文の詳細を見る
• 一般社団法人日本機械学会の論文
• 2001-10-20

著者

• Li Ming

  Institute Of Computer Software And Theory Of Xi'an Jiaotong University

• Hayward James

  Advanced Micro Devices

• Chen William

  ASE (U.S.) Inc.

• Tseng Andy

  ASE (U.S.) Inc.

• Li Ming

  Institute Of Materials Research & Engineering

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