H102 LOCAL HEAT TRANSFER CHARACTERISTICS IN SIMULATED ELECTRONIC MODULES(Electronics cooling-1)

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概要

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• When the heat is released by forced convection from electronic modules in a narrow printed circuit board channel, complex flow phenomena - such as stagnation and acceleration on the front surface, separation and reattachment on the top surface, wake or cavity flow near the rear surface - affect the heat transfer characteristics. The purpose of this study is to investigate how these flow conditions influence heat transfer from electronic modules. Experiments are performed three-dimensional array of hexahedral elements as well as two-dimensional array of rectangular elements. Naphthalene sublimation technique is employed to measure three dimensional local mass transfer, and the mass transfer data are converted to their counter part of heat transfer process using the analogy equation between heat and mass transfer. Module location and streamwise module spacing are varied, and effect of vortex generator on heat transfer enhancement is examined. Dramatic change of local heat transfer coefficients is found on each surface of the module. Three-dimensional module have a little higher heat transfer value than two-dimensional modules because of bypass flow..

• 一般社団法人日本機械学会の論文
• 2000-10-01

著者

• Park Jong-hark

  Department Of Mechanical Design Engineering Chungnam National University

• Yoo Seong-yeon

  Department Of Mechanical Design Engineering Chungnam National University

• Chung Min-Ho

  Department of Mechanical Design Engineering, Chungnam National University

• Chung Min-ho

  Department Of Mechanical Design Engineering Chungnam National University

関連論文

• H102 LOCAL HEAT TRANSFER CHARACTERISTICS IN SIMULATED ELECTRONIC MODULES(Electronics cooling-1)

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