TED-AJ03-205 STUDIES OF EVAPORATIVE WATER SPRAY COOLING ON MICRO-STRUCTURED SILICON SURFACES

概要

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Low-mass-flux spray cooling on plain and micro-structured silicon surfaces was studied experimentally. Evaporation of deposited thin liquid film is the dominant heat transfer mechanism in this study. The micro-structured surfaces with finer grooves (120 μm wide), regardless of system orientation, have higher heat removal ability and better surface temperature uniformity because of the better liquid film spreading and holdup. Substantial temperature fluctuation may occur and the surface temperature may become significantly uneven once the heated surface is partially dryout. This is possibly unfavorable to electronic cooling applications. In dryout regime, surface enhancement has negligible effect on heat transfer performance. Systems with down facing heated surface have the least heat removal rate among all the orientations examined in this paper. Due to the considerable liquid overflow, vertical surfaces with an impact angle of 30° have much higher heat transfer rate than surfaces with normal spray impaction.
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