TED-AJ03-332 INTEGRATED ELECTROPLATED HEAT SPREADERS FOR HIGH POWER SEMICONDUCTOR LASERS

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概要

• 論文の詳細を見る

• Thermal management of high power semiconductor lasers and laser arrays is demanding and challenging due to the low thermal conductivity of the laser substrate and active device layers, In this work, metal heat spreaders of high thermal conductivity directly electroplated on the semiconductor lasers is investigated to improve the laser performance by avoiding the use of low thermal conductivity interface materials and thus reduce the thermal resistance of the lasers. Copper heat spreaders with different sizes are directly electroplated on the structures that mimic edge-emitting semiconductor lasers. The size effect of these heat spreaders is experimentally demonstrated through comparison with reference samples. A two-dimensional analytical model is developed to verify the thermal resistance experimental data. The results from the model fit the experimental data very well.

• 一般社団法人日本機械学会の論文

著者

• Chen Gang

  Mechanical Engineering Department Massachusetts Institute Of Technology

• Chen Gang

  Mechanical And Aerospace Department University Of California At Los Angeles

• Snyder G.

  Jet Propulsion Laboratory

• Fu Jianping

  Mechanical Engineering Department, Massachusetts Institute of Technology

• Yang Ronggui

  Mechanical Engineering Department, Massachusetts Institute of Technology

• Fleurial Jean

  Jet Propulsion Laboratory

• Yang Ronggui

  Mechanical Engineering Department Massachusetts Institute Of Technology

• Fu Jianping

  Mechanical Engineering Department Massachusetts Institute Of Technology

関連論文

• Heat Conduction Mechanisms and Phonon Engineering in Superlattice Structures
• TED-AJ03-332 INTEGRATED ELECTROPLATED HEAT SPREADERS FOR HIGH POWER SEMICONDUCTOR LASERS

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