TED-AJ03-122 HEAT TRANSFER CHARACTERISTICS OF A NATURAL CIRCULATION LIQUID COOLING SYSTEM FOR ELECTRONIC COMPONENTS

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概要

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• Experiments were conducted to study the flow and heat transfer characteristics of a natural circulation cooling system with phase change for electronic components. The cooling system shown in Fig. A1 was a closed-loop circuit consisting of a test section, a horizontal evaporator, a vertical tube, a horizontal condenser, a rubber bag attached at the exit of condenser, a downcomer, a flow meter, and a liquid cooler. The height of the vertical tube was 450 mm. FC-72 was filled in the closed loop. The level of FC-72 was mainly set at 300 mm above the evaporator. In the test section, a silicon chip with dimensions of 10×10×0.5 (mm)^3 bonded on a polycarbonate plate was fixed at the bottom of a horizontal duct with dimensions of 5×14 (mm)^2. The evaporator was used to maintain the annular flow in the vertical tube. Three kinds of silicon chips, one with a smooth surface and two with square micro-pin-fins with fin dimensions of 30 × 60 and 30 × 200 μm^2 (thickness × height), respectively, were tested. The fin pitch was twice the fin thickness. These chips were named chip S, chip PF60 and chip PF200,respectively. The test chip was electrically heated by a d.c. current. Preliminary experiments showed that the flow rate of FC-72 was strongly dependent on the static head difference between the two vertical tubes ΔP. It was also observed that there was a minimum value of ΔP below which the flow became unstable. Experiments were conducted at the liquid subcooling ΔT_<sub> of 5,10,25 and 35 K. The flow rate of FC-72 was set at 150 and 200 g/min. The results were compared with those for pool boiling. Figure A2 shows examples of the heat transfer results for chips S, PF60 and PF200 at ΔT_<sub> = 35 K. The critical heat flux increased in the order of chips S, PF60 and PF200. All chips showed the boiling curve similar to the case of pool boiling except that the critical heat flux was 5-18% smaller than pool boiling.[figure]

• 一般社団法人日本機械学会の論文

著者

• Honda H.

  Institute of Advanced Material Study, Kyushu University

• Takamatsu H.

  Institute of Advanced Material Study, Kyushu University

• Yamashiro H.

  Institute Of Advanced Material Study Kyushu University

• WEI J.

  Interdisciplinary Graduate School of Eng. Sciences, Kyushu University

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• TED-AJ03-122 HEAT TRANSFER CHARACTERISTICS OF A NATURAL CIRCULATION LIQUID COOLING SYSTEM FOR ELECTRONIC COMPONENTS

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