317 セラミックス粒子分散アルミニウム系複合材料の弾性係数および減衰能の温度依存性(OS セラミックス,CMC及びMMC)

概要

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Elastic moduli and damping capacities of 70vol%SiC/Al, 55vol%SiC/Al, 60vol%Al_2O_3 /Al, 70vol%AlN/Al and 30vol%SiC/Al composites were studied by using torsional vibrasion technique. The temperature-dependent damping was mesured at temperatured from 293K to 85OK. A damping relexation peak was observed at 〜600K on each samples. The damping peak at 〜600K is caused by interfacial diffusion between ceramic particles and Al interface. The activation energy of each iterfacial diffution was 40.7〜56.7KJ/mol on SiC/Al, 62.1KJ/mol on Al_2O_3 /Al and 27.7KJ/mol on A1N/A1. The increase of the damping capacity in all samples over 700K is caused by the plastic flow at the grain boundary. The activation energy of plastic flow was 42.3〜119KJ/mol.
一般社団法人日本機械学会の論文
2000-11-24