464 逐次 2 点法によるシリコン基板の平面度測定に関する研究

概要

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With the development of high integration of semiconductor devices, silicon wafers with larger dimensions are required aiming at improve the productivity. Meanwhile, high accuracy of the flatness is also acquired. In this study, applicability of the Sequential-Two-Point Method has been evaluated in the straightness analysis of the surface form. The analysis method based on measurement of the peripheral of the substrate and in the radial direction, in terms of the polar axis system, has been proposed. Rotation of the substrates and linear movement of the sensors are realized by the actuators on hydrostatic bearing. Capacitor-type high Precision sensors with high resolution were used and the influence of the support conditions on the results of straightness analysis has been shown.
一般社団法人日本機械学会の論文
2000-09-01