OS2(4)-17(OS02W0433) Nondestructive Testing of Bonding Integrity Between Tiles and Wall Using Sonic-Shearography

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概要

• 論文の詳細を見る
• 一般社団法人日本機械学会の論文
• 2003-09-09

著者

• Shang Huai

  School Of Mechanical & Production Eng. Nanyang Technological Univ.

• Hung Michael

  Dept. of Manufacturing Eng. and Eng. Management, City Univ. of Hong Kong

• Hung Michael

  Dept. Of Manufacturing Eng. And Eng. Management City Univ. Of Hong Kong

関連論文

• OS1(5)-19(OS01W0435) A Unified Approach for Holography and Shearography in Surface Deformation Measurement and Nondestructive Testing
• OS2(4)-17(OS02W0433) Nondestructive Testing of Bonding Integrity Between Tiles and Wall Using Sonic-Shearography

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