一様温度変動下でのサーフェスマウント継手の二次元熱応力解析

概要

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This study deals with the thermal stress in a surface mount joint under uniform temperature change, where an upper element is mounted on a substrate and is adhesively bonded/soldered near both ends. The analytical approach is developed mainly in the case of the plane strain state and general solutions for the thermal stress and the strain distributions in the joint are derived using the two-dimensional theory of elasticity. It is shown by numerical calculations that the thermal stress is singular at both edges of the interfaces between the upper element and the adhesive, and between the substrate material and the adhesive. Maximum principal thermal stresses are examined in several types of joints in order to predict a fracture initiating point in a surface mount joint. In the experiments, the thermal stress distribution in an adhesive layer is measured by photoelasticity. From the comparisons between the analytical results and the experimental ones obtained by photoelasticity, fairly good agreement is shown.
一般社団法人日本機械学会の論文
1994-04-25