A Study on the Stress Measurement by Cu Electro-Plating

概要

論文の詳細を見る
Cause of flecking occurring on the surface of Cu electro-plating subjected to cyclic stress was investigated. It was known that two types of flecks occur, one caused by slip bands and the other by chemical change on the surface, and the number of flecks caused by slip bands is much more than that of ones by chemical change. Relation between the rate of increase in the density of grown grains generated in the plating layer and the number of cyclic stressings was also investigated. This relation is expressed by the same equation as the one between the rate of recrystallization of the cold-rolled pure copper and the heating time. Therefore, it is presumed that the mechanisms of grain growth and recrystallization may be identical. And it was also clarified that the relation between the density of grown grains, r, and the cycles of stress, N, is expressed by the equation, r=l-exp(-BN^4), approximately.
一般社団法人日本機械学会の論文