Bonding Strength Evaluation of a Metal-Resin Adhering Interface Formed by Resin Molding

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概要

• 論文の詳細を見る

• Bonding strength of a metal (Fe-Ni alloy) and resin (epoxy base) adhering interface was examined under thermal stress occurring in the cooling process of the thermoset resin after adhesion. Thermal stresses on the adhering interface were calculated using the finite element method. Calculated stresses and the experimental strength were compared. The following results were obtained. Bonding strength of a metal and resin adhering interface under thermal loads can be estimated mainly by using shearing stress on the adhering interface (τ_<yz>) ; an accurate strength estimation can be obtained by taking into account the normal stress on the adhering interface (σ_z).

• 一般社団法人日本機械学会の論文
• 1988-07-15

著者

• Hattori T

  Mechanical Engineering Research Laboratory Hitachi Ltd.

• Hattori Toshio

  Hitachi Ltd. Mechanical Engineering Research Laboratory

• Hatsuda T

  Hitachi Ltd. Ibaraki Jpn

• HATSUDA Toshio

  Hitachi Ltd.

• SAKATA Sohji

  Hitachi Ltd., Mechanical Engineering Research Laboratory

• Sakata Sohji

  Hitachi Ltd. Mechanical Engineering Research Laboratory

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• A Stress Singularity Parameter Approach for Evaluating Adhesive Strength
• Bonding Strength Evaluation of a Metal-Resin Adhering Interface Formed by Resin Molding
• Torsional Fatigue Strength of a Shrink Fitted Shaft

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