The Development of a Die-sensor : Vibration, Control Engineering, Engineering for Industry
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概要
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A new sensor to detect stress and temperature in plastic deformation processes has been developed. Installed in a die, this sensor can detect both pressure and frictional stresses acting on the same point of the die surface. Moreover, it can simultaneously detect surface temperature. The sensor is designed to detect pressure from 0 to 300 MPa and frictional stresses from 0 to 150 MPa. The principle of detecting 3-directional stress is that for the deformation of a parallel plate structure. Surface temperature is calculated from the two temperatures detected by two pairs of thermocouples at different points under the surface. The sensor is called a Die-sensor. Examples of measurements are shown, and applications of the sensor are discussed.
- 一般社団法人日本機械学会の論文
著者
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Hatamura Yotaro
The University Of Tokyo
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Yoneyama T
Kanazawa Univ. Kanazawa Jpn
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YONEYAMA Takesi
Kanazawa University
関連論文
- A Trial on Direct Forming with Vibration
- The Development of a Die-sensor : Vibration, Control Engineering, Engineering for Industry