B24-074 MEASUREMENT OF MECHANICAL PROPERTIES OF TWO ELECTROPLATING FILMS BY NANOINDENTATION TEST

概要

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Mechanical properties of copper and nickel electroplating films made for experimental are examined using nanoindentation test. The properties obtained were compared with those of each bulk material and they were associated to metallurgical aspects of the films. The plane {111} Peak height value of each film measured in X ray diffraction analysis was relatively lower than that of the bulk material at the ratios of only 1/30 for Cu and 1/10 for Ni, respectively, implying that the crystal structure of the films was amorphous rather than crystalline. The residual elastic strain of the films calculated from a deviation angle was highly compressive in the order of 10^<-3>. Average hardness value of the Ni film was 50 % higher than that of the Ni bulk material, while in the Cu film it was inversely 20 % lower than that of the Cu bulk material. The dissimilarity between the Cu film and the Ni film in the hardness was attributed to a porous structure formed during the plating. Eath Young's modulus value of the films was higher than that of the bulk materials at the ratios of 14 % for Cu and 19 % for Ni, respectively.
一般社団法人日本機械学会の論文
2003-11-30