A23-016 MICRO-FABRICATED THERMAL MANAGEMENT SYSTEMS FOR LIQUID COOLING OF HIGH POWER CHIPS
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概要
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Increasing functionality and speed of high performance electronic systems call for continuing increase in the average heat flux at the chip level, along with large spatial non-uniformity in its distribution. For portable systems, there are also increasing constraints on the allowable size of thermal management solutions, in the face of increasing overall heat dissipation rates. These often conflicting requirements are prompting a fresh look at cooling solutions for electronic components and systems. In this paper, we focus on three liquid cooling schemes for chip or package level cooling. These schemes incorporate components utilizing microfabrication techniques. Single phase cooling using stacked microchannels offers some unique performance advantages and design flexibility over a single layer of microchannels. In situations requiring the use of dielectric liquids, phase change heat removal offers an attractive means for enhancing heat transfer. The incipience superheat excursion typically seen in boiling of dielectric liquids from plain surfaces is avoided by using a highly porous microfabricated boiling enhancement structure, within a highly confined evaporator. A two phase thermosyphon incorporating this evaporator and a condenser has been successfully assembled and characterized. The same boiling enhancement structure has also been utilized in fabricating and evaluating a new type of thin heat spreader utilizing boiling.
- 一般社団法人日本機械学会の論文
- 2003-11-30
著者
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Sunil Murthy
G. W. Woodruff School Of Mechanical Engineering Georgia Institute Of Technology
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Joshi Yogendra
G. W. Woodruff School of Mechanical Engineering Georgia Institute of Technology
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Wei Xiaojin
G. W. Woodruff School of Mechanical Engineering Georgia Institute of Technology