ファインセラミックスの研削加工特性 : 加工条件と研削抵抗

概要

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Fine ceramic materials have become increasingly important in modern industrial fields due to their unique properties. But few reports describe their machining characteristics. This investigation was carried out systematically in wide machining conditions with diamond wheels in order to obtain the machining characteristics of fine ceramics. As the result it was found that the ratio of the normal grinding force to the tangential grinding force (F_n/F_t) was very large comparing with the ratio in metal grinding. The ratio was 12〜16 for Si_3N_4-ceramics and 5〜6 for SiC ceramics. This shows that SiC ceramics is easier to cause microfracture than Si_3N_4 ceramics. The specific energy, needed to remove a unit volume, changed depending on grinding conditions. The relation between specific energy and non-dimensional undeformed chip thickness was linear on the logarithmic scale. In the condition where the undeformed chip thickness decreased, the specific energy increased. The rate of increase differed depending on ceramic material, and the gradient for Si_3N_4 ceramics was larger than that for SiC ceramics. The specific energy of Si_3N_4 ceramics was larger than that of SiC ceramics in the region of small undeformed chip thickness, but the result was the opposite in the condition of large undeformed chip thickness. This shows the difference of machinable characteristics between them.
社団法人日本材料学会の論文
1985-06-15