液晶ディスプレイ実装技術の開発(第2報) : 液晶駆動ICの伸びのメカニズム解明
スポンサーリンク
概要
- 論文の詳細を見る
A high-density mounting technology for liquid crystal drive IC and liquid crystal substrates has been developed to achieve high-definition liquid crystal displays. The material to connect liquid crystal drive IC and the liquid crystal substrate is anisotropic conductive film (ACF). Formerly, 250μm connection pitch was used as a joining material between liquid crystal drive IC and liquid crystal substrate. Now, connection pitch has been increased to 50μm. To achieve this high-density mounting technology, it was necessary to clarify the stretching mechanisms for the liquid crystal drive IC and anisotropic conductive film, which have different thermal expansion rates. Apart from the elucidation of the stretching mechanism, by the discovery of new mounting conditions to restrain the stretching, mounting technology featuring a 50μm connection pitch for joining, which had been thought impossible in the past, has been established. Thus realization of the high-definition liquid crystal display has been achieved.
- 公益社団法人精密工学会の論文
- 2002-09-05
著者
関連論文
- 高精細液晶ディスプレイ用実装システムの開発
- 液晶ディスプレイ実装技術の開発(第2報) : 液晶駆動ICの伸びのメカニズム解明
- 高精細液晶ディスプレイ実装システムの開発(第2報) : 液晶駆動ICボンディングツールの熱解析
- 液晶ディスプレイ実装技術の開発(第1報) : 異方性導電膜の信頼性
- 高精細液晶ディスプレイ実装システムの開発(第1報) : 液晶駆動ICボンディングヘッドの熱解析
- 液晶ディスプレイ用TCPアウタリ-ドボンダ
- 高精度アウタリ-ドボンディング技術 (〔東芝〕生産技術研究所創立20周年記念)