磁気ディスク基板のポリシング加工 : 基板表面平滑特性
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概要
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This paper deals with smoothing characteristics of substrate surface roughness by polishing. An attempt was made to analyze the smoothing quantity of surface roughness, when changing polishing conditions. In the analysis, a formula on the pressure distribution between substrate surface roughness and polisher was derived from Hertz's formula. An equation about the smoothing quantity of surface roughness derived involving the smoothing primary texture and waviness of surface roughness. Calculated smoothing quantities of surface roughness were in agreement with experimental results. The smoothing characteristics of surface roughness which has been conceptually considered can be explained well by the derived equation. The polishing conditions of disk substrate are discussed. In order to smooth surface roughness with a little stock removal quantity at short polishing time, the disk substrate should be polished with low pressure and with high relative velocity.
- 公益社団法人精密工学会の論文
- 1990-02-05