人工キャビティを有する模擬チップの浸漬沸騰冷却

概要

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Pool boiling heat transfer results from a 10mm×10mm rectangular chip immersed in subcooled FC-72 were reported. Three kinds of surface were tested: an untreated silicon wafer surface, an etched SiO2 surface formed on a silicon wafer, and the same kind of SiO2 surface with artificial cavities. The cavities were the re-entrant type with mouth diameters ranged from 0.6 to 1.2\mum. These artificial cavities were effective for the reduction in boiling incipient superheat. The boiling incipient temperature agreed well with the theoretical value estimated from the boiling nucleation theory. The chip temperature at fully developed nucleate boiling as well as at the boiling incipience was reduced significantly by dissolved air.
九州大学の論文