Effect of Zn Addition to Sn-3Ag-5Bi Solder on Joint Strength and Joint Interface

概要

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The mechanical properties and the joint strength of Sn-Ag-Bi solders as replacement solders for Sn-Pb eutectic solder were investigated. The joint strength between Cu sheets and solder decreases when more than 5 mass% Bi is added to Sn-Ag system solders afterannealing. Zn addition to Sn-3Ag-5Bi solderis carried out in order to improve the joint strength. The effectof Zn addition to Sn-3Ag-5Bi solder on the joint strength and the joint interface structure was investigated. Zn addition to Sn-3Ag-5Bi solder changes the joint interface structure from solder/Cu-Sn intermetallic compounds/Cu to solder/Cu-Zn intermetallic compound/Cu-Sn intermetallic compound/Cu. Cu-Zn intermetallic compound acts as a barrier layer for inhibiting the growth of Cu-Sn reactionlayer. Therefore, the growth of reactionlayer and decrease ofjoint strength are inhibited by Zn addition after annealing.
秋田大学の論文