Indium Addition on Intermetallic Compound Evolution in Tin-Silver Solder Bump
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概要
- 論文の詳細を見る
- 2011-07-01
著者
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Yuan Yuan
State Key Laboratory Of Transducer Technology Shanghai Institute Of Micro-system And Information Tec
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Luo Le
State Key Laboratory Of Transducer Technology Shanghai Institute Of Micro-system And Information Tec
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WANG Dongliang
State Key Laboratory of Transducer Technology, Shanghai Institute of Micro-system and Information Technology, Chinese Academy of Sciences
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Wang Dongliang
State Key Laboratory Of Transducer Technology Shanghai Institute Of Micro-system And Information Technology Chinese Academy Of Sciences