Ultrasonic Brazing of Alumina to Copper Using Zn-Sn Filler
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概要
- 論文の詳細を見る
- 2003-07-20
著者
-
Naka Masaaki
Joining And Welding Research Institute Osaka University
-
Hafez Khalid
Joining And Welding Research Institute Osaka University
関連論文
- Control of Hardness Distribution in Friction Stir Welded AA2024-T3 Aluminum Alloy
- Microstructure and Mechanical Properties of Friction Stir Welded AA2024-T3 Aluminum Alloy
- Interfacial Microstructure of Silicon Carbide and Titanium Aluminide Joints Produced by Solid-State Diffusion Bonding
- Solid State Diffusion Bonding of Silicon Nitride Using Vanadium Foils
- 408 REACTION SYNTHESIS OF NiAl-TiC COMPOSITES AND IN-SITU JOINING TO Ni_3Al ALLOYS
- Arc Light Sensing of Droplet Transfer and Its Analysis in Pulsed GMAW Process
- The Welding Arc Spectrum and The Improved Arc Light Information for Welding Process Control
- Fabrication and Microstructural Characterization of In-situ Bonded Joints between Ni_3Al and TiC/Ni_3Al Composites
- Prediction for Uniaxial Mechanical Response of SnPb Eutectic Alloy
- First Principles Ab Initio Calculations of β-Silicon Nitride
- SHS Joining of Advanced Materials for High Temperature Applications
- Ultrasonic Brazing of Alumina to Copper Using Zn-Sn Filler
- Effect of Ultrasound Applying Time on the Strength of Cu/Al_2O_3 Braze Joint
- Diffusion Bonding of Hard Alloy and Structure Steel with Iron-Based Insert Metal