A Novel 3D Power Divider Based on Half-Mode Substrate Integrated Circular Cavity

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概要

• 論文の詳細を見る

• A new kind of 3D power divider based on a half-mode substrate integrated circular cavity (HSICC) is proposed. This novel power divider can reduce the size of a power divider based on normal substrate integrated circular cavity (SICC) by nearly a half. To verify the validity of the design method, a two-way X-band HSICC power divider using low temperature co-fired ceramic (LTCC) technology is designed, fabricated and measured.

• （社）電子情報通信学会の論文
• 2011-03-01

著者

• Fan Yong

  Extreme High Frequency Library University Of Electronic Science And Technology Of China

• GU Jian

  Extreme High Frequency Library, University of Electronic Science and Technology of China

• JIN Haiyan

  School of Communication and Information Engineering, University of Electronic Science and Technology

• Jin Haiyan

  School Of Communication And Information Engineering University Of Electronic Science And Technology

• Gu Jian

  Extreme High Frequency Library University Of Electronic Science And Technology Of China

関連論文

• A Novel 3D Power Divider Based on Half-Mode Substrate Integrated Circular Cavity
• A Novel Wideband Spatial Power Combining Amplifier Based on Turnstile-Junction Waveguide Divider/Combiner

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