Simulations of Solidification in Sn-3Ag-0.5Cu Alloys by the Multi-phase-field Method

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概要

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• The microstructural evolutions in a Sn–3Ag–0.5Cu system of lead free alloys were predicted by the multi-phase field simulation coupled with CALPHAD thermodynamic database. In this simulation, the growth of Cu6Sn5 at 250°C and the precipitations of Cu3Sn and Ag3Sn at 150°C were calculated. These calculated micrographs were in good agreement with the experimental measurements. It was confirmed that this calculation method can be applied to the simulation of microstructures in the solidification of lead-free solder system including a Cu-substrate.

• 社団法人 日本鉄鋼協会の論文
• 2010-12-15

著者

• Nomura Yuko

  Itochu Techno-solutions Corporation

• MINAMOTO Satoshi

  ITOCHU Techno-Solutions Corporation

• NOMOTO Sukeharu

  ITOCHU Techno-Solutions Corporation

関連論文

• Numerical Simulation for Grain Refinement of Aluminum Alloy by Multi-phase-field Model Coupled with CALPHAD
• Simulations of Solidification in Sn-3Ag-0.5Cu Alloys by the Multi-phase-field Method

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