Back-etch method for plan view transmission electron microscopy sample preparation of optically opaque films
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概要
- 論文の詳細を見る
- 2008-04-01
著者
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YAO Bo
Advanced Materials Processing and Analysis Center, Department of Mechanical, Materials and Aerospace
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COFFEY Kevin
Advanced Materials Processing and Analysis Center, Department of Mechanical, Materials and Aerospace
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Yao Bo
Advanced Materials Processing And Analysis Center And Department Of Mechanical Materials And Aerospa
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Coffey Kevin
Advanced Materials Processing And Analysis Center And Department Of Mechanical Materials And Aerospa
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Coffey Kevin
Advanced Materials Processing And Analysis Center And Department Of Mechanical Materials And Aerospa
関連論文
- A high-throughput approach for cross-sectional transmission electron microscopy sample preparation of thin films
- A modified back-etch method for preparation of plan-view high-resolution transmission electron microscopy samples
- Back-etch method for plan view transmission electron microscopy sample preparation of optically opaque films