Microelectronic Wire Bonding with Insulated Au Wire : Effects of Process Parameters on Insulation Removal and Crescent Bonding
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2008-10-01
著者
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Mayer Michael
Microjoining Lab Centre For Advanced Materials Joining Department Of Mechanical And Mechatronics Eng
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LEE Jaesik
Microjoining Lab, Centre for Advanced Materials Joining, Department of Mechanical and Mechatronics E
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ZHOU Norman
Microjoining Lab, Centre for Advanced Materials Joining, Department of Mechanical and Mechatronics E
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PERSIC John
Microbonds Inc.
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Lee Jaesik
Microjoining Lab Centre For Advanced Materials Joining Department Of Mechanical And Mechatronics Eng
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Zhou Norman
Microjoining Lab Centre For Advanced Materials Joining Department Of Mechanical And Mechatronics Eng