Mechanical Properties and Microstructure of Tin-Silver-Bismuth Lead-Free Solder
スポンサーリンク
概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2002-08-01
著者
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Serizawa Koji
Packaging Technology Center Production Engineering Research Laboratory Hitachi Ltd.
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SHIMOKAWA Hanae
Packaging Technology Center, Production Engineering Research Laboratory, Hitachi Ltd.
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SOGA Tasao
Packaging Technology Center, Production Engineering Research Laboratory, Hitachi Ltd.
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Soga Tasao
Packaging Technology Center Production Engineering Research Laboratory Hitachi Ltd.
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Shimokawa Hanae
Packaging Technology Center Production Engineering Research Laboratory Hitachi Ltd.