CuAl Alloy Interconnects as a Solution to the Trade-off between Reliability and Defect Density

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概要

• 論文の詳細を見る
• 2006-09-13

著者

• Nagaki Y.

  Renesas Technology Corp.

• FURUSAWA T.

  Renesas Technology Corp.

• KODAMA D.

  Renesas Technology Corp.

• MIYAZAKI H.

  Renesas Technology Corp.

• MATSUMOTO M.

  Renesas Technology Corp.

• IZUMITANI J.

  Renesas Technology Corp.

• MATSUMOTO H.

  Renesas Technology Corp.

• FUKUI S.

  Renesas Technology Corp.

• HASHIMOTO K.

  Renesas Technology Corp.

• TAWA S.

  Renesas Technology Corp.

• OKADA M.

  Renesas Technology Corp.

• TOMITA K.

  Renesas Technology Corp.

• MINOURA Y.

  Renesas Technology Corp.

• ISHII A.

  Renesas Technology Corp.

• AMOU N.

  Renesas Technology Corp.

• MORI K.

  Renesas Technology Corp.

• MAEKAWA K.

  Renesas Technology Corp.

• SUZUMURA N.

  Renesas Technology Corp.

• HONDA K.

  Renesas Technology Corp.

• HIROSE Y.

  Renesas Technology Corp.

• OSAKI A.

  Renesas Technology Corp.

• Matsumoto H.

  University Of New Hampshire

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• CuAl Alloy Interconnects as a Solution to the Trade-off between Reliability and Defect Density
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