Process Realization for 3-D ICs using Fine Pitch Through Silicon Vias
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概要
- 論文の詳細を見る
- 2004-09-15
著者
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Burkett S.
University Of Arkansas High Density Electronics Center
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SCHAPER L.
University of Arkansas, High Density Electronics Center
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SPIESSHOEFER S.
University of Arkansas, High Density Electronics Center
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VANGARA G.
University of Arkansas, High Density Electronics Center
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RAHMAN Z.
University of Arkansas, High Density Electronics Center
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POLAMREDDY S.
University of Arkansas, High Density Electronics Center
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Schaper L.
University Of Arkansas High Density Electronics Center
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Vangara G.
University Of Arkansas High Density Electronics Center
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Polamreddy S.
University Of Arkansas High Density Electronics Center
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Spiesshoefer S.
University Of Arkansas High Density Electronics Center
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Rahman Z.
University Of Arkansas High Density Electronics Center