Alignment-Free Optical Modules Using Solder-Bump-Bonding Technique for Free-Space Optical Interconnections
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概要
- 論文の詳細を見る
- 2008-02-01
著者
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Matsushita Kenji
Deptartment Of Physical Electronics And Informatics Graduate School Of Engineering Osaka City Univer
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MIYAZAKI Daisuke
Deptartment of Physical Electronics and Informatics, Graduate School of Engineering, Osaka City Univ
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OHNO Yuji
Deptartment of Physical Electronics and Informatics, Graduate School of Engineering, Osaka City Univ
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Ohno Yuji
Deptartment Of Physical Electronics And Informatics Graduate School Of Engineering Osaka City Univer
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Miyazaki Daisuke
Deptartment Of Physical Electronics And Informatics Graduate School Of Engineering Osaka City Univer