Screening Life Cycle Assessment of Silver-Based Conductive Adhesive vs. Lead-Based Solder and Plating Materials
スポンサーリンク
概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2007-08-01
著者
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YAMAGUCHI Hiroshi
Research and Development Initiative, Chuo University
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Inaba Atsushi
Research Center For Life Cycle Assessment National Institute Of Advanced Industrial Science And Tech
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ANDRAE Anders
Research Center for Life Cycle Assessment, National Institute of Advanced Industrial Science and Tec
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ITSUBO Norihiro
Faculty of Environmental and Information Studies, Musashi Institute of Technology
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Andrae Anders
Research Center For Life Cycle Assessment National Institute Of Advanced Industrial Science And Tech
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Yamaguchi Hiroshi
Research And Development Initiative Chuo University
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Itsubo Norihiro
Faculty Of Environmental And Information Studies Musashi Institute Of Technology
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Yamaguchi Hiroshi
Research Center For Life Cycle Assessment National Institute Of Advanced Industrial Science And Tech
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