A High-Speed Thermoelectric Infrared Sensor Fabricated by CMOS Technology and Micromachining (特集 次世代自動車センシングシステム)
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概要
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A high-speed thermoelectric infrared sensor has been fabricated by the CMOS process and micromachining. The time constant of the sensor has been reduced by means of a reduction of sensor size and a thin Si3N4 membrane structure. The sensitivity has been improved with a precisely patterned Au black infrared absorption layer formed by a PSG lift-off process. The characteristics of the sensor have been simulated using a thermal equivalent circuit model. A time constant of 270 μsec and sensitivity of 60 V/W at atmospheric pressure have been achieved. This time constant is smaller than any other reported value of thermopiles.
- 2006-08-01