Component Candidacy of Second Side Reflow with Lead-Free Solder

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概要

• 論文の詳細を見る
• 2006-06-20

著者

• SHANGGUAN Dongkai

  Flextronics

• LIU Yueli

  Auburn University, ECE Department

• GEIGER David

  Flextronics

• Liu Yueli

  Auburn University Ece Department

関連論文

• Metallurgy and Kinetics of Liquid-Solid Interfacial Reaction during Lead-Free Soldering
• Component Candidacy of Second Side Reflow with Lead-Free Solder
• Component Candidacy of Second Side Reflow with Lead-Free Solder

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