A 100±15nm Thick 8-inch Bonded SOI Fabricated with a Selective Polishing Method
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概要
- 論文の詳細を見る
- 1996-08-26
著者
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Shimanoe M.
Ulsi R&d Laboratories Semiconductor Company Sony Corporation
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HASHIMOTO M.
ULSI R&D Laboratories, Semiconductor Company, Sony Corporation
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OHKUBO Y.
ULSI R&D Laboratories, Semiconductor Company, Sony Corporation
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NAKAMURA M.
ULSI R&D Laboratories, Semiconductor Company, Sony Corporation
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SATO H.
ULSI R&D Laboratories, Semiconductor Company, Sony Corporation
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KOMATSU H.
ULSI R&D Laboratories, Semiconductor Company, Sony Corporation
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MIYAZAWA Y.
ULSI R&D Laboratories, Semiconductor Company, Sony Corporation