Reliability and Electromigration Failure Modes in Dual Inlaid Cu Interconnects
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概要
- 論文の詳細を見る
- 2000-08-28
著者
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Thrasher S.
Advanced Products Research And Development Laboratory Digitaldna^<tm> Laboratories Motorola
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Capasso C.
Advanced Products Research And Development Laboratory
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HERRICK M.
Advanced Products Research and Development Laboratory DigitalDNA^ Laboratories, Motorola
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GALL M.
Advanced Products Research and Development Laboratory DigitalDNA^ Laboratories, Motorola
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JAWARANI D.
Advanced Products Research and Development Laboratory DigitalDNA^ Laboratories, Motorola
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ZHAO L.
Technology Development Group, Advanced Micro Devices
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KAWASAKI H.
Advanced Products Research and Development Laboratory DigitalDNA^ Laboratories, Motorola
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Gall M.
Advanced Products Research And Development Laboratory
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Herrick M.
Advanced Products Research And Development Laboratory Digitaldna^<tm> Laboratories Motorola
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Jawarani D.
Advanced Products Research And Development Laboratory
関連論文
- Reliability and Electromigration Failure Modes in Dual Inlaid Cu Interconnects
- ELECTROMIGRATION in W PLUG, Al FILLED, and Cu FILLED VIAS