Flip Chip Bump Formation of Sn-1.8Bi-0.8Cu-0.6In Solder by Stencil Printing
スポンサーリンク
概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2005-11-20
著者
-
Mayer Michael
Dept. Of Mechanical Engineering University Of Waterloo
-
Zhou Yunhong
Dept. Of Mechanical Engineering University Of Waterloo
-
Jung Jae-pil
Dept. Of Material Sci. And Eng. University Of Seoul
-
Jung Jae-pil
Dept. Of Materials Science And Engineering University Of Seoul
-
Lee Jaesik
Dept. Of Mechanical Engineering University Of Waterloo
-
CHEON Chu-Seon
Danyang Soltec Co. Ltd.
関連論文
- Shear Strength and Interfacial Compound of Sn-Ag-Bi-In Alloy
- Flip Chip Bump Formation of Sn-1.8Bi-0.8Cu-0.6In Solder by Stencil Printing