Novel Stacked Packaging Structure Using Silica-Based PLC with Integrated Micro-Mirrors and Its Application to 8ch PD Array Module(Optical Interconnection, <Special Section>IS-EMD2004-Recent Development of Electro-Mechanical Devices)
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概要
- 論文の詳細を見る
We propose and demonstrate a new stacked packaging structure using silica-based planar lightwave circuits (PLCs) with integrated micro-mirrors. This structure enables us to integrate active devices on PLCs with certain flexibility as regards optical coupling design and device selection. To achieve this, we developed an integrated micro-mirror with an accurate reflection angle and shielding structures to prevent crosstalk, and successfully demonstrated an 8-channel photodiode array module with excellent characteristics consisting of a high responsivity of > 0.85 A/W and a low crosstalk of < -65 dB.
- 社団法人電子情報通信学会の論文
- 2005-08-01
著者
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Doi Yoshiyuki
Ntt Photonics Laboratories Ntt Corporation
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OGAWA Ikuo
NTT Photonics Laboratories
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ABE Makoto
NTT Photonics Laboratories, NTT Corporation
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SUZUKI Senichi
NTT Photonics Laboratories, NTT Corporation
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Abe Makoto
Ntt Photonics Laboratories Ntt Corporation
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Suzuki Senichi
Ntt Photonics Laboratories Ntt Corporation
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Abe Makoto
Ntt Photonics Laboratories
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Doi Yoshiyuki
NTT Photonics Laboratories, NTT Corporation
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