Investigation of Defect Reduction on Copper Chemical-Mechanical Polishing for Advanced BEOL Interconnections

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概要

• 論文の詳細を見る
• 2002-06-06

著者

• Hsu Chia-lin

  United Microelectronics Corp.

• CHEN Hsueh-Chung

  United Microelectronics Corp.

• HSU Shih-Hsun

  United Microelectronics Corp.

• HU Shao-Chung

  United Microelectronics Corp.

• TASI Teng-Chun

  United Microelectronics Corp.

• HSIEH Wen-Yi

  United Microelectronics Corp.

関連論文

• Investigation of Defect Reduction on Copper Chemical-Mechanical Polishing for Advanced BEOL Interconnections

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