Microsampling technique for EBSP inspection on the cross-sections of copper trench lines in ULSIs
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概要
- 論文の詳細を見る
- 2004-10-01
著者
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Fukumoto Koji
Wafer Process Engineering Development Division Lsi Manufacturing Technology Unit Renesas Technology
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Mashiko Yoji
Wafer Process Engineering Development Division Lsi Manufacturing Technology Unit Renesas Technology
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Hashikawa Naoto
Wafer Process Engineering Development Division Lsi Manufacturing Technology Unit Renesas Technology
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HIROSE Yukinori
Wafer Process Engineering Development Division, LSI Manufacturing Technology Unit, Renesas Technolog
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Hirose Yukinori
Wafer Process Engineering Development Division Lsi Manufacturing Technology Unit Renesas Technology