Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni

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概要

• 論文の詳細を見る
• 2004-03-20

著者

• Hwang Chi-won

  Isir Osaka University

• HWANG Chi-Won

  ISIR, Osaka University

• SUGANUMA Katsuaki

  ISIR, Osaka University

• Suganuma Katsuaki

  Isir Osaka University

関連論文

• Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni
• S1-3 Decomposition behaviour and morphology change of noble metal oxide by ultrasonic irradiation(Symposium (1) Sonochemical Innovation in Materials Processing)

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