Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2004-03-20
著者
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Chen Sinn-wen
Department Of Chemical Engineering National Tsing Hua University
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LIN Shih-kang
Department of Chemical Engineering, National Tsing Hua University
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JAO Jui-meng
Department of Chemical Engineering, National Tsing Hua University
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Lin Shih-kang
Department Of Chemical Engineering National Tsing Hua University
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Jao Jui-meng
Department Of Chemical Engineering National Tsing Hua University
関連論文
- Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints
- Isoplethal Sections of the Liquidus Projection and the 250℃ Phase Equilibria of the Sn-Ag-Cu-Ni Quaternary System at the Sn-Rich Corner